JPH0741158Y2 - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPH0741158Y2 JPH0741158Y2 JP1988040783U JP4078388U JPH0741158Y2 JP H0741158 Y2 JPH0741158 Y2 JP H0741158Y2 JP 1988040783 U JP1988040783 U JP 1988040783U JP 4078388 U JP4078388 U JP 4078388U JP H0741158 Y2 JPH0741158 Y2 JP H0741158Y2
- Authority
- JP
- Japan
- Prior art keywords
- cap
- semiconductor device
- internal wiring
- resin
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 31
- 239000011347 resin Substances 0.000 claims description 17
- 229920005989 resin Polymers 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 16
- 239000004020 conductor Substances 0.000 claims description 4
- 238000000465 moulding Methods 0.000 description 8
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 230000003071 parasitic effect Effects 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000011109 contamination Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988040783U JPH0741158Y2 (ja) | 1988-03-28 | 1988-03-28 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988040783U JPH0741158Y2 (ja) | 1988-03-28 | 1988-03-28 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01145133U JPH01145133U (en]) | 1989-10-05 |
| JPH0741158Y2 true JPH0741158Y2 (ja) | 1995-09-20 |
Family
ID=31267245
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988040783U Expired - Lifetime JPH0741158Y2 (ja) | 1988-03-28 | 1988-03-28 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0741158Y2 (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6638823B2 (ja) | 2016-10-24 | 2020-01-29 | 三菱電機株式会社 | 半導体装置 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59152647A (ja) * | 1983-02-21 | 1984-08-31 | Sumitomo Electric Ind Ltd | 多層配線方法 |
| JPS6194352U (en]) * | 1984-11-26 | 1986-06-18 |
-
1988
- 1988-03-28 JP JP1988040783U patent/JPH0741158Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01145133U (en]) | 1989-10-05 |
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